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Webinar on “An overview of the oneM2M Standard and its Deployment Models” (10 June, 2019: Webinar)
June 10, 2019 @ 7:30 pm - 9:00 pm
TSDSI is proud to announce a Webinar on “An overview of the oneM2M Standard and its Deployment Models” on 10 June 2019
Topic Abstract:
This talk will first provide a brief overview and introduction of the oneM2M standard. This will include a deeper dive into a few of the oneM2M value-add services to provide a better appreciation and understanding of the types of services the oneM2M standard defines. Next the talk will provide an overview of how oneM2M is being leveraged in real-life deployments and how these deployments incorporate and leverage oneM2M in some different ways. This will provide attendees a better appreciation of the flexibility, extensibility and scalability of the oneM2M standard and the value it has to offer to IoT deployments. The talk will conclude with some information regarding oneM2M maturity, adoption and deployment status.
Speaker: Mr Dale Seed, Principal Engineer, InterDigital Inc.
Speaker Bio: Dale Seed is a Principal Engineer at InterDigital, Inc. In this role, Dale participates in several M2M/IoT industry standards bodies including oneM2M, IETF and ETSI. He is an active contributor working to define technologies that are helping shape and enable the Internet of Things. Dale currently serves as Chairman of the oneM2M System Design and Security (SDS) Working Group. Dale is also heavily involved in the architecture and design of InterDigital’s oneM2M-based IoT Platform and interfaces to business and product management teams within InterDigital as well as external customers and partners. Dale has worked at InterDigital for 10+ years and before joining InterDigital, he held positions at Intel and Lucent Technologies. As an employee of InterDigital, he is also a member of Convida Wireless which is a Joint Venture partnership between InterDigital and Sony focused on researching future IoT technology areas.
Schedule: June 10, 2019 19:30 – 21:00 IST
Participation: Participation in the Webinar is open to all. Click here for joining the webinar.
Venue: Webinar